We at Fuji Chemical specialize in both fine chemical technology pertaining to adhesives, coating, potting and printing and resin processing technology for precision extrusion molding of engineering plastics. We aim to contribute to society by assisting our customers with industrial technology and our engineering service of printed circuit board assembly.
NEPCON West China 2012 in Chengdu
■ Date : 19-21 Jun. 2012
■ Venue:New International Convention & Exhibition Center >> More information
NEPCON China 2012 in Shanghai 25-27 Apr. 2012
Apr. 13, 2012
NEPCON China 2012 in Shanghai
■ Date : 25-27 Apr. 2012
■ Venue :Shanghai World Expo Convention & Exhibition Center
■ Booth No.:1G26 >> More information
Notification of discontinued sale, Seal-glo NE8800TH
We intend to run a booth at JISSO PROTEC 2011- 13th Jisso Process Technology Exhibition.
June 1st, 2011
■ We intend to run a booth at JISSO PROTEC 2011- 13th Jisso Process Technology Exhibition.
■ Exhibition Period:June 1, 2011 (Wed) to June 3, 2011 (Fri) >> http://www.jpcashow.com/show2011/English/
Renewal our official Web site
May 25, 2011
Renewal our official Web site
We DO NOT have any damages such as the break of our plants
April 4, 2011
We DO NOT have any damages such as the break of our plants, production facilities and human sufferings by the great earthquake occurred in Eastern Japan at March 11, 2011. We are now under investigation about raw materials. We produce Seal-glo products as usual. Our shipments are without any problem. We will inform our customers if the procuration of raw materials is delayed and it affects our products. Thank you for your patience.
Notification of our headquarter relocation
July 26, 2010
We are pleased to announce that we have moved into the new headquarter on July 26th 2010.
Our new location will be:
3-1-7, Nagata Higashi, Higashi Osaka City, Osaka 577-0012, Japan
TEL: 06-6744-8800 FAX: 06-6744-8840